High Performance Computing
The US Department of Defense has tapped Argonne spin-out Parallel Works to link its supercomputing centres to AWS, Azure, Google Cloud and Oracle through one secure platform – speeding up the AI and simulation workloads now reshaping defence research.
Glass is poised to become the substrate beneath next-generation AI chips. Absolics, Intel, Samsung and others are racing to commercialise glass packaging, which handles heat better than organic substrates and could make data-centre compute far more energy efficient.
Sandia National Laboratories is testing NextSilicon’s reconfigurable accelerator, a chip that rewires itself to the software it runs, promising big power savings over Nvidia GPUs without costly code rewrites.
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