AMD
Glass is poised to become the substrate beneath next-generation AI chips. Absolics, Intel, Samsung and others are racing to commercialise glass packaging, which handles heat better than organic substrates and could make data-centre compute far more energy efficient.
WHY THIS MATTERS IN BRIEF Tokenized compute could create an AI-native capital stack, allowing models to self-finance infrastructure while bypassing…
WHY THIS MATTERS IN BRIEF Analogue computing is fast and energy efficient, and it might also be the future of…
WHY THIS MATTERS IN BRIEF Data centers are getting bigger, AI needs more data faster, and now some of the…
WHY THIS MATTERS IN BRIEF As China grapples with trying to develop 5nm chips TSMC is about to start producing…
WHY THIS MATTERS IN BRIEF As US GPU sanctions bite China Chinese companies are starting to build their own next…
WHY THIS MATTERS IN BRIEF The cost of training new AI models as we look to an AGI future is…
WHY THIS MATTERS IN BRIEF China wants to achieve global tech dominance by 2045, and computing power is the key…
WHY THIS MATTERS IN BRIEF As we start contemplating 1nm chips the increase in computing power will be huge. …
WHY THIS MATTERS IN BRIEF You’ve maybe not heard of either of these companies, but both are revolutionary in their…
WHY THIS MATTERS IN BRIEF Exascale computing has been a long time coming, and the power of these machines could…
WHY THIS MATTERS IN BRIEF Supercomputers are always getting faster, and now for the first time one has smashed the…