Vietnam
18th April 2026
Glass is poised to become the substrate beneath next-generation AI chips. Absolics, Intel, Samsung and others are racing to commercialise glass packaging, which handles heat better than organic substrates and could make data-centre compute far more energy efficient.
4th December 2023
WHY THIS MATTERS IN BRIEF In this keynote session futurist Matthew Griffin explores the next decade of aviation and how…
19th October 2021
WHY THIS MATTERS IN BRIEF In time almost all new technologies improve in performance and this is a staggering new…