Chip Architectures
Researchers at the Hong Kong University of Science and Technology have built ReAAP, a reconfigurable processor that pairs a smart software compiler with adaptable hardware to run deep neural networks up to 5.7x faster than a leading GPU and 3.3x faster than an ARM CPU.
Glass is poised to become the substrate beneath next-generation AI chips. Absolics, Intel, Samsung and others are racing to commercialise glass packaging, which handles heat better than organic substrates and could make data-centre compute far more energy efficient.
Sandia National Laboratories is testing NextSilicon’s reconfigurable accelerator, a chip that rewires itself to the software it runs, promising big power savings over Nvidia GPUs without costly code rewrites.
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